Метод оценки долговечности контактных соединений компонентов электронных плат при произвольной нагрузке

Abstract

This paper describes a method for assessing the durability of contact joints BGA and PGA components of electronic circuit boards with an arbitrary load. The method on the experimental data and the results of numerical simulation of contact connections at working loads is based. The implementation of this method is shown in the example of the electronic board evaluation period of the service under cyclic thermal loads. Application of this method of electronic circuit board manufacturers will predict the service life of the developed products.