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dc.contributor.authorNesterenko, Tamara Georgievnaen
dc.contributor.authorKoleda, Aleksey Nikolaevichen
dc.contributor.authorBarbin, Evgeny Sergeevichen
dc.date.accessioned2018-03-29T08:57:15Z-
dc.date.available2018-03-29T08:57:15Z-
dc.date.issued2018-
dc.identifier.citationNesterenko T. G. Integrated microelectromechanical gyroscope under shock loads / T. G. Nesterenko, A. N. Koleda, E. S. Barbin // IOP Conference Series: Materials Science and Engineering. — 2018. — Vol. 289 : Modern Technologies for Non-Destructive Testing : 6th International Conference, 9–14 October 2017, Tomsk, Russian Federation : [proceedings]. — [012003, 7 p.].en
dc.identifier.urihttp://earchive.tpu.ru/handle/11683/47008-
dc.description.abstractThe paper presents a new design of a shock-proof two-axis microelectromechanical gyroscope. Without stoppers, the shock load enables the interaction between the silicon sensor elements. Stoppers were installed in the gyroscope to prevent the contact interaction between electrodes and spring elements with fixed part of the sensor. The contact of stoppers occurs along the plane, thereby preventing the system from serious contact stresses. The shock resistance of the gyroscope is improved by the increase in its eigenfrequency at which the contact interaction does not occur. It is shown that the shock load directed along one axis does not virtually cause the movement of sensing elements along the crosswise axes. Maximum stresses observed in the proposed gyroscope at any loading direction do not exceed the value allowable for silicon.en
dc.language.isoenen
dc.publisherIOP Publishingru
dc.relation.ispartofIOP Conference Series: Materials Science and Engineering. Vol. 289 : Modern Technologies for Non-Destructive Testing. — Bristol, 2018.en
dc.rightsinfo:eu-repo/semantics/openAccessen
dc.subjectгироскопыru
dc.subjectударные нагрузкиru
dc.subjectдизайнru
dc.subjectконтактные напряженияru
dc.subjectмикросистемыru
dc.subjectмикроэлектромеханические системыru
dc.subjectэлектроникаru
dc.subjectакселерометрыru
dc.titleIntegrated microelectromechanical gyroscope under shock loadsen
dc.typeConference Paperen
dc.typeinfo:eu-repo/semantics/publishedVersionen
dc.typeinfo:eu-repo/semantics/conferencePaperen
dcterms.audienceResearchesen
local.description.firstpage12003-
local.filepathhttp://dx.doi.org/10.1088/1757-899X/289/1/012003-
local.identifier.bibrecRU\TPU\network\24318-
local.identifier.perskeyRU\TPU\pers\30970-
local.identifier.perskeyRU\TPU\pers\33286-
local.identifier.perskeyRU\TPU\pers\36470-
local.localtypeДокладru
local.volume289-
local.conference.nameModern Technologies for Non-Destructive Testing-
local.conference.date2017-
dc.identifier.doi10.1088/1757-899X/289/1/012003-
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