Please use this identifier to cite or link to this item: http://earchive.tpu.ru/handle/11683/47008
Title: Integrated microelectromechanical gyroscope under shock loads
Authors: Nesterenko, Tamara Georgievna
Koleda, Aleksey Nikolaevich
Barbin, Evgeny Sergeevich
Keywords: гироскопы; ударные нагрузки; дизайн; контактные напряжения; микросистемы; микроэлектромеханические системы; электроника; акселерометры
Issue Date: 2018
Publisher: IOP Publishing
Citation: Nesterenko T. G. Integrated microelectromechanical gyroscope under shock loads / T. G. Nesterenko, A. N. Koleda, E. S. Barbin // IOP Conference Series: Materials Science and Engineering. — 2018. — Vol. 289 : Modern Technologies for Non-Destructive Testing : 6th International Conference, 9–14 October 2017, Tomsk, Russian Federation : [proceedings]. — [012003, 7 p.].
Abstract: The paper presents a new design of a shock-proof two-axis microelectromechanical gyroscope. Without stoppers, the shock load enables the interaction between the silicon sensor elements. Stoppers were installed in the gyroscope to prevent the contact interaction between electrodes and spring elements with fixed part of the sensor. The contact of stoppers occurs along the plane, thereby preventing the system from serious contact stresses. The shock resistance of the gyroscope is improved by the increase in its eigenfrequency at which the contact interaction does not occur. It is shown that the shock load directed along one axis does not virtually cause the movement of sensing elements along the crosswise axes. Maximum stresses observed in the proposed gyroscope at any loading direction do not exceed the value allowable for silicon.
URI: http://earchive.tpu.ru/handle/11683/47008
Appears in Collections:Материалы конференций

Files in This Item:
File Description SizeFormat 
dx.doi.org-10.1088-1757-899X-289-1-012003.pdf740,75 kBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.